Vapour phase solder support for process profiling

May 18, 2011 // By Julien Happich
Vapour phase solder support for process profiling
SolderStar 's newly developed system features a unique design to allow profiling of vapour phase soldering processes. The system is usable in both batch and inline machines, including those with vacuum stages. The sealed thermal barrier comprises a lightweight outer skin coated with PTFE to minimise energy absorption from the vapour, yet achieves two times the performance of a standard reflow system.

A small form factor data logger is installed inside the shield to capture profile information from the circuit board being processed; information can also be relayed in real-time to the use via a 2.4GHz telemetry link. For the quick preparation of a test, thermocouple connectors are fitted to the outside of the barrier. After each run through the machine, the barrier can be opened and the data logger easily removed; this approach provides faster cool down cycles and reduced possibility of damage to the data logger unit. The software supplied with the system has additional support for definition of the vapour phase process allowing engineer to quickly establish the optimum settings for a given assembly.

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