The 1-inch by 2.6-inch format OV13860 image sensor is back-side illuminated and uses large 1.3-micron pixels and leverages OmniVision's new stacked die technology to deliver exceptional low-light performance while meeting the design constraints of low z-height camera modules.
The OV16850 is also 1-inch by 2.6-inch in size and uses a smaller 1.12-micron pixel format and stacked die technology in a native 16:9 aspect ratio, ensuring no loss in field of view when viewing on 1080p or 1440 quad HD smartphone screens.
"16-megapixel sensors represent another milestone in the 'megapixel race' for higher resolution cameras in smartphones," said Bahman Hadji, product marketing manager at OmniVision, in a statement.
However, it is notable that Toshiba has announced a 20-Mpixel image sensor in a 1-inch by 2.4-inch format albeit with a 6mm z height (see Toshiba launches faster, smaller 20-Mpixel image sensor ). The 13-Mpixel OmniVision sensor has a z height of 5mm and the OmniVision 16-Mpixel image sensor allows a module height of 5.5mm, is sampling and is expected to enter volume production in the first quarter of 2015.
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